Purification and coatings

Purity constraints:

• Our purity processes allow us to achieve extremely low impurity levels, to below 5 ppm.
• The ETV-ICP method is used to detect and monitor impurities to levels below 5 ppb.

Cleanliness constraints:

• Vitreous Carbon Impregnation (VCI) was developed to reduce particle emissions and the vacuum outgassing of materials, particularly for semi-conductor applications.

Resistance to reagents used in plasma processes:

• Mersen products can be coated with a thin layer of pyrolitic carbon thereby reducing the material's permeability to reactive products to a minimum, particularly for semi-conductor applications.
• In order to further enhance the resistance to process reagents, Mersen proposes core impregnation with resin to reduce porosities.

Resistance to hydrogen above 900 °C, MOCVD reagents, and strong acids (HCl, HF)

• Mersen has mastered the deposition of silicon carbide thin films which provides unequalled protection of graphite equipment in particularly harsh environments.